TechFlow reports, on July 05, an Everbright Securities research report indicated that leading domestic fluorine chemical enterprises are accelerating their deployment of new fluorine materials, focusing on creating a second growth curve. In the semiconductor field, high-purity (such as G5 grade) electronic grade hydrofluoric acid, as an indispensable key wet electronic chemical for chip manufacturing, was long monopolized by Japanese and American enterprises. In recent years, domestic enterprises have leveraged integrated industry chain advantages to break through bottlenecks in ultra-clean high-purity processes; electronic grade hydrofluoric acid has successfully passed strict certifications from domestic and international first-line wafer foundries and entered the phase of scaled production.
Meanwhile, the rapid rise in computing power of AI, HPC, and hyperscale data centers has caused the heat density of data centers to continue to increase. Traditional air cooling solutions have gradually become insufficient to meet demands in high power density scenarios, and liquid cooling is becoming an essential solution for efficient heat dissipation. Fluorine chemical enterprises are following the trend of efficient heat dissipation, actively deploying high-performance fluorine-containing cooling fluids such as perfluoropolyether (PFPE). Relying on their insulating, non-flammable, and excellent thermal management performance, these fluids occupy an irreplaceable position in high-security, high-power scenarios such as immersion liquid cooling. New fluorine materials are driving fluorine chemical enterprises to undergo a profound transformation towards high technical barriers and high value-added directions. (Jin10)
