Event Details
BuidlerCon 2023, hosted by AC Capital and co-organized by Molecular Hub, BlockTides, Mesolabs, and GLITCH Global, aims to promote collaboration among builders in the Non-EVM ecosystem and jointly explore the future development and market landscape of the Non-EVM space.
The Hong Kong SAR Government places great importance on fintech development. This summit also receives special support from InvestHK, Hong Kong Science and Technology Parks Corporation, and Wireless Technology Industry Association. King Leung, Head of Fintech at Hong Kong Investment Promotion Agency, along with Senior Managers Terry Chan and Icy Yau, will attend as guests.
The event also partners with KuCoin Ventures, OKX Ventures, OFR Fund, Sky9Capital, Zonff Partners, BasicsCapital, Waterdrip Capital, Zhichun Capital, and other institutions to further advance Hong Kong's Web3 industry, actively and diversely building the Non-EVM ecosystem together with the government.
On July 26, Hong Kong government financial leaders, over 20 industry leaders, 40+ investment institutions, 20+ media outlets, 100+ developer communities, and top-tier builders focused on the Non-EVM ecosystem will gather in Hong Kong to discuss hot topics such as the implementation of emerging Non-EVM ecosystems and their future potential, better addressing the challenges of Non-EVM adoption.
Provisional Event Agenda
Ticketing for attendees is now open, aiming to provide more people with opportunities to learn about the progress of the Non-EVM ecosystem. More keynote speakers will be announced soon. Sponsorships and business collaborations are still being recruited. Join BuidlerCon 2023 to work alongside the Hong Kong government and leading Asian investment institutions to energize the Non-EVM ecosystem.
The BuidlerCon 2023 Demo Day is also launching simultaneously, focusing on discovering tomorrow's stars within the Non-EVM ecosystem. Online registration for Demo Day is now open. Outstanding projects selected online will gain qualification for offline pitching events in Hong Kong. High-quality projects from around the world are welcome to showcase their innovations and gain comprehensive exposure, mentorship, funding, and other resources.
Ticketing and Application Links
Hong Kong Offline Summit Ticket (Chinese): Registration Link
Hong Kong Offline Summit Ticket (English): Registration Link
Apply for Demo Day: Application Link
Event Application: Application Link
