TechFlow news — On November 28, according to official announcements, the Hong Kong Monetary Authority (HKMA) launched the "Digital Bond Subsidy Scheme." Originating from the 2024 Policy Address, the scheme aims to promote the development of the digital securities market and encourage broader use of tokenization technology in capital markets. The application for the three-year program is now open. Eligible digital bond issuances in Hong Kong can receive subsidies of up to HK$2.5 million.
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