TechFlow reports that DIN, the first modular AI data preprocessing layer, has officially launched pre-mining for Chipper nodes, which will run until December 4.
DIN node pre-mining primarily generates xDIN, which serves as the main basis for the DIN token airdrop. During the pre-mining phase, Wafer points holders can convert their Wafer into xDIN. Node operators earn xDIN and BNB by running nodes. Users with abundant computing resources can apply to become node delegators and run delegated nodes to earn additional xDIN. Currently, xDIN is an on-chain points token and does not support transfers, but it can be traded on the off-chain trading platform Tadle. Note that trading may result in loss of airdrop eligibility; users may decide at their own discretion whether to trade.
At the DIN TGE, all users will receive the DIN airdrop based on their xDIN holdings. Notably, this portion of the airdropped DIN will be released 100% upfront, with no locking or linear vesting mechanisms.
