TechFlow announces $4 million in funding for its modular AI-native data preprocessing layer DIN, and officially launches node sales
7x24h News
TechFlow announces $4 million in funding for its modular AI-native data preprocessing layer DIN, and officially launches node sales
According to Cointelegraph, DIN, the first modular AI-native data preprocessing layer, has completed a $4 million pre-listing funding round, with participation from Manta, Moonbeam, Ankr, Maxx Capital and others. This brings DIN's total funding to $8 million. Previously, DIN announced a $4 million seed round led by Binance Labs, HashKey Capital, NGC Ventures, Shima Capital, IVC, LIF, Big Brain Holdings, and Archerman Capital. On August 20, DIN officially launched the Chipper node sale, allowing users to participate in building the AI data economy by purchasing and operating nodes. A total of 131,600 Chipper nodes will be offered across 10 tiers, utilizing a multi-tiered pricing system. Tier 1 nodes are currently available for claim exclusively to product-active users and active community contributors; Tier 2 nodes are now officially on sale, while Tier 3 and above will become available on August 22.
TechFlow reported on August 20 that, according to Cointelegraph, DIN—the first modular AI-native data preprocessing layer—has raised $4 million in pre-token funding. Investors include Manta, Moonbeam, Ankr, and Maxx Capital, bringing DIN's total funding to $8 million to date. Previously, DIN announced a $4 million seed round led by Binance Labs, HashKey Capital, NGC Ventures, Shima Capital, IVC, LIF, Big Brain Holdings, and Archerman Capital.
On August 20, DIN officially launched the Chipper node sale, enabling users to participate in building the AI data economy by purchasing and operating nodes. A total of 131,600 Chipper nodes will be offered across 10 tiers, with a multi-level pricing system. Tier 1 nodes are currently available for claim exclusively to product-active users and active community contributors; Tier 2 nodes went on sale today, while Tiers 3 and above will become available on August 22.




