TechFlow news: According to an announcement by the China National Intellectual Property Administration, Tencent Technology (Shenzhen) Co., Ltd. has filed a patent application entitled "Blockchain Transaction Packaging Method, Device, Equipment, Storage Medium, and Program Product," with publication number CN117609361A and filing date October 2023.
The patent abstract reveals that embodiments of the present application disclose a blockchain transaction packaging method, device, equipment, storage medium, and program product.
The method includes: obtaining sub-transaction signatures corresponding to t business data items, where the sub-transaction signatures are generated by transaction-sending nodes using their respective sub-transaction private keys; sub-transaction public keys of the same transaction-sending node are derived from its sub-transaction private key; aggregating the sub-transaction signatures corresponding to the t business data items to generate a first aggregated signature for the t business data items; packaging the t business data items and the first aggregated signature into a first transaction block, and sending the first transaction block to consensus nodes so that the consensus nodes verify the t business data items based on the first aggregated signature; and upon successful verification of the t business data items by the consensus nodes, performing on-chain processing of the first transaction block. This application reduces the data volume in transaction packaging and improves transaction verification efficiency.
