TechFlow News — Payment service provider Due has announced a $3.3 million seed funding round led by Semantic and Fabric Ventures, with participation from BlockTower, Speedinvest, Polymorphic Capital, and Discovery Ventures. The new capital will be used to further develop Due's technology and expand its fiat on-ramp services into additional markets.
Due is currently building a platform that connects domestic payment channels using open and interoperable blockchain protocols. Due is set to launch this month, linking payment channels in the United States, Europe, the UK, and South Africa. The company plans to expand into Latin America and the Asia-Pacific region in the first quarter of next year.
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