TechFlow news, June 30, Prudential Group Portfolio Specialist Amanda Ng pointed out in a report that the next phase of AI-related investment opportunities may appear further upstream in the supply chain, rather than those high-profile AI platforms or chip manufacturers. She noted that fields such as advanced packaging, semiconductor substrates, and high-end printed circuit boards (PCB) are becoming increasingly critical. Although these components account for a relatively small proportion of the total bill of materials required for AI, they may still become critical bottlenecks. She also mentioned that even if the prices of these products rise only slightly, it can significantly boost manufacturers' profits, while remaining affordable for end customers. (Jin10)
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