TechFlow reported, according to the Shanghai Securities News, that Shandong Hi-Speed Group has issued the "Shandong Hi-Speed Group Co., Ltd. 2024 Publicly Offered Technology Innovation Renewable Corporate Bonds (Phase I)," which has been listed and traded on the Shanghai Stock Exchange.
This bond raised $350 million through China's central bank digital currency (CBDC), setting a precedent for future financial products and achieving a record-low coupon rate of 2.94% in Shandong Province with a 3+N-year tenor.
The technology innovation bond was underwritten by CITIC Securities as the lead underwriter, with GF Securities, Dongxing Securities, Orient International Investment Banking, and Huatai United Securities serving as joint lead underwriters.
