TechFlow news, Bond Protocol has completed a $2.5 million seed round led by Chapter One Ventures and IDEO CoLab Ventures, with participation from Alchemy Ventures, Hypersphere, among others. Earlier on October 4, Bond Protocol also launched its Beta version.
Reportedly, in July this year, the proposal to spin off OlympusDAO's bond market platform Olympus Pro and rebrand it as Bond Protocol was approved. Olympus will utilize Bond Protocol for its bonding operations, and Bond Protocol will offer features such as permissionless markets, composable bonds (tokenized), and modular auction interfaces.Source link




